Target Market Segments
for 3D Circuit Printing
We want to give you the freedom
to 3D print high-resolution
or very thick electronic
circuits, bumps and bonding
layers through the AMEBA 3D
(S-ECAM for 3D Circuit) series
of machines.
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S-ECAM additionally prints a high-temperature thermal resistant bonding material such as Ag on the target area of the
substrate of ceramic PCB for high-power semiconductor in which the circuit pattern has already been manufactured.
S-ECAM can effectively print circuits with a thickness of 200 ~ 2000 ㎛ using a multi-electrode module.For this, the
DfAM (Design for Additive Manufacturing) should be performed the improvement of circuit design in advance.
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