Target Market Segments
for 3D Circuit Printing
We want to give you the freedom
to 3D print high-resolution
or very thick electronic
circuits, bumps and bonding
layers through the AMEBA 3D
(S-ECAM for 3D Circuit) series
of machines.
01
S-ECAM can print 3 ~ 300 ㎛ diameter and 10 ~ 500 ㎛ height of bumps (pillars) within the aspect ratio of 1:5 using the multi-electrode module of strip size. S-ECAM can print additional structures and spacers required by the PCB design or process demands, and it is also possible to directly print circuits on the PCB substrate for prototyping.
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