Target Market Segments
for 3D Circuit Printing
We want to give you the freedom
to 3D print high-resolution
or very thick electronic
circuits, bumps and bonding
layers through the AMEBA 3D
(S-ECAM for 3D Circuit) series
of machines.
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S-ECAM prints bumps with a diameter of 3 to 6 ㎛ on the backplane to enable bonding with wafers or modules that im
plement μ-LEDs for the display device inside Augmented Reality (AR) glasses system. S-ECAM can print 3D microelec
tronic circuits on the surface of transparent and flexible polymer materials, and provide the high degree of design free
dom for the wearable device or sensor and the ultra-precision circuits in the Bio and Healthcare fields.
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